Job Purpose & Position Summary

● Manage the research and development engineers responsible for the development of packaging technology & equipment technology, substrate design and material development

● Work with cross functional teams including business unit, sustaining engineering, quality and customer service teams to develop packaging solution or provide simulations for the customers in order to gain customer satisfaction and facilitate the success of product launch. This position requires strong technology, product/program management skills and business acumen to drive/deliver critical technology milestones.

● Team development and talent acquisition

Job Responsibilities

●Primary Responsibilities:

1.     Develop and drive package and technology roadmap that meet future business/customer requirements and increase the organization’s competitive position

2.     Responsible for package design, design verification and simulations  

3.     Responsible for packaging materials research, characterization, application and selection.

4.     Develop the equipment technology along with the package roadmap.

5.     Responsible for design for manufacturing (DFM) for the success of customer products.

6.     Ensure new packages, technology and material being developed are cost effective and fully characterized and robust for mass production (Establish robust design and assembly rule)

7.     Ensure effective project management and review systems for all new designs and R&D projects

8.     Drive development activities with customers, suppliers, learning institutions or government agencies to define top class benchmark technology compared with other OSATs

9.     Ensure proper succession planning, talent development and retention programs

10.  Drive IP creations and support government incentives application

11.  Provide leadership and mentoring to the next level to ensure proper succession planning.

12.  Train, develop and retain team member with at least one back up for each critical position

13.  Support critical customer issues, including investigation, experiment, simulations, etc.

14.  Other duties as assigned by supervisor.

●Impact of Decision:

1.     Failure to achieve results might cause delays in meeting significant product or program commitments and result in both allocations of more resources and/or significant financial and/or business impact.

2.     Impact to functional efficiencies (short-term goals).

Job Qualifications

●Must Have:

Knowledgeable in FCBGA, Advanced Material development, packaging development and technology deployment.

  - Education: Bachelor Degree or above in electrical, mechanical, thermal  engineering or equivalent

  - Language: Excellent oral and written skills in English

  - Experience: >10 years’ work experience including 5~8 years’ semiconductor industry experience

in a high paced environment

    - Core Tools/ Skills Requirement:  APQP/PPAP/SPC/MSA/FMEA

>Meal allowance (true badge ).

>Unlimited visit to Panel Clinic for employee, spouse and children.

>Outpatient specialist (RM1000 each)yearly for employee, spouse and children

>Interest Car subsidy

> EPF – 16%